Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized FPDs

Suitable for direct bonding of driver IC which drives a flat panel display onto substrate. With both excellent conductivity and insulating property between terminals for fine pitch interconnection.

Product Lineup

Product name CP692 series CP345 series CP540 series
Type COG
Connection material I C
Glass substrate
Minimum space [µm] *1 12
Minimum connection area[µm2]2]※2 1,300 1,000、1,400 500
Thickness [µm] 20 18 18
Conductive particles Type Au/Ni plating on a polymer core particle Ni plating on a polymer core particle Ni plating on a polymer core particle
Particle diameter[µmФ] 3 3 3.0～3.2
Insulation coated particle 〇
Main bonding conditions Temperature [℃] 190～210 150～180 130～160
Time [sec] 5
Pressure [MPa]※3 60～80 30～80 40～80
Product name PAF300 series PAF400 series
Type COG COG/COP
Connection material I C I C
LCD Glass substrate OLED Glass substrate/Flexible substrate
Minimum space [µm] *1 5 8
Minimum connection area[µm2]2]※2 400 720
Thickness [µm] 16 10
Conductive particles Type Ni plating on a polymer core particle Ni plating on a polymer core particle
Particle diameter[µmФ] 3.2 3.0
Insulation coated particle 〇 〇
Main bonding conditions Temperature [℃] 130～160 190～230
Time [sec] 5 5
Pressure [MPa]※3 40～80 60～90 ※4
  • ※1 Minimum space: Space between adjacent circuits.
  • ※2Please contact us for information on σ value control of the minimum connection area for each product individually.
  • ※3Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. 
    The pressure at FOG, FOB and FOF bonding is described as the bonding area.
  • ※4Recommended pressure at COG bonding . Please contact us for information on the pressure at COP bonding.

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