Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized FPDs

Suitable for direct bonding of driver IC which drives a flat panel display onto substrate. With both excellent conductivity and insulating property between terminals for fine pitch interconnection.

  • Product name
    PAF400 series
  • Features
    • The particles arraying technique arrays conductive particles at the targeted positions and the particles immobilizing technique suppresses flow of them during the bonding provide stable particle capturing performance with a small number of particles.
    • Decreasing the number of conductive particles and immobilizing them reduces the risk of short-circuit for fine-pitch connections.
    • In interconnection of IC and a panel, it provides a minimum connection area of 720 µm2 and a minimum space of 8 µm.

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Structure

Specifications

Product name PAF400 series
Type COG/COP
Connection material IC
OLED Glass substrate/Flexible substrate
Minimum space [µm] *1 8
Minimum connection area[µm2] *2 720
Thickness [µm] 10
Conductive particles Type Ni plating on a polymer particle
Particle diameter [µmФ] 3.0
Insulation coated particle Yes
Main bonding conditions Temperature [℃] 190 to 230
Time [sec] 5
Pressure [MPa] *3 60 to 90 *4
  • *1Minimum space: Space between neighboring circuits.
  • *2Please contact us for information on σ value control of the minimum connective area for each product individually.
  • *3Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB and FOF mounting is described as the bonding area.
  • *4Recommended pressure at COG mounting. Please contact us for information on the pressure at COP mounting.

Interconnection of small-to-medium-sized FPDs and an IC chip.

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

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