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- Anisotropic Conductive Film (ACF) for Film On Glass for small-to-medium-sized FPDs
Anisotropic Conductive Film (ACF)
Anisotropic Conductive Film (ACF) for Film On Glass for small-to-medium-sized FPDs
Product Lineup
Product Name | CP133 series | PAF700 series | |
---|---|---|---|
Type | FOG | FOG/FOP | |
Connection material | TCP/COF/FPC | COF | |
Glass substrate | Glass substrate/Flexible substrate | ||
Minimum space [µm] *1 | 25 | 5 | |
Minimum connection area [µm2] *2 | 12,000 | 1,000 to 1,500 | |
Thickness [µm] | 18, 25 | 10 | |
Conductive particles | Type | Ni plating on a polymer particle | Ni plating on a polymer particle |
Particle diameter [µmФ] | 4 | 3.2 | |
Insulation coated particle | Yes | ||
Main bonding conditions | Temperature [℃] | 180 to 200 | 160 to 180 |
Time [sec] | 8 | 5 | |
Pressure [MPa] *3 | 3 to 5 | 3 to 8 |
- *1Minimum space: Space between adjacent circuits.
- *2Please contact us for information on σ value control of the minimum connection area for each product individually.
- *3Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.
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