Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Glass for small-to-medium-sized FPDs

Suitable for interconnection of small-to-medium-sized FPDs and film materials.

Product Lineup

Product name CP133 series PAF700 series
Type FOG FOG/FOP
Connection material TCP/COF/FPC COF
Glass substrate Glass substrate/Flexible substrate
Minimum space [µm] *1 25 5
Minimum connection area[µm2]2]※2 12,000 1,000～1,500
Thickness [µm] 18, 25 10
Conductive particles Type Ni plating on a polymer core particle Ni plating on a polymer core particle
Particle diameter[µmФ] 4 3.2
Insulation coated particle 〇
Main bonding conditions Temperature [℃] 180～200 160～180
Time [sec] 8 5
Pressure [MPa]※3 3～5 3～8
  • ※1 Minimum space: Space between adjacent circuits.
  • ※2Please contact us for information on σ value control of the minimum connection area for each product individually.
  • ※3Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps.
    The pressure at FOG, FOB and FOF bonding is described as the bonding area.

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Product information

Optical Semiconductor

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