Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Board / Film for alternative to connector and solder connection

Suitable for interconnection of rigid board and film materials or interconnection between film materials. The lineup includes types that can be stored at room temperature.

Product Lineup

Product name CP801AM-35AC CP850CG-35AJ
Connection material
Minimum space [µm] *1 100
Minimum connection area [µm2] *2 100,000 200,000
Thickness [µm]
Conductive particles Type Au/Ni plating on a polymer core particle Ag plating on a polymer core particle
Particle diameter [µmФ] 10 20
Insulation coated particle No
Main bonding conditions Temperature [℃] 180 to 200 110 to 140
Time [sec] 10 to 15 3 to 7
Pressure [MPa] *3 2 to 4 1 to 3
      • *1Minimum space: Space between adjacent circuits.
      • *2Please contact us for information on σ value control of the minimum connection area for each product individually.
      • *3Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.

Safety Data Sheet (SDS) Download