Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Glass for large FPDs

Suitable for interconnection of ITO Glass and COF (FOG).

  • Product name
    CP10000 series
  • Features
    • Unique adhesive composition with excellent performance for bonding 2 or 3 layer FPCs.
    • Both optimum conductivity in vertical and complete insulation in horizontal enable fine-pitch interconnections by our unique insulating coating technology on conductive particle.



Product name CP10000 series
Type FOG
Connection material COF/FPC
Glass substrate
Minimum space [µm]*1 10 to 25
Minimum connection area [µm2]*2 5,000 to 15,000
Thickness[µm] 14 to 20
Conductive particles Type Ni plating on a polymer core particle or Au/Ni plating on polymer core particle
Particle diameter [µmФ] 3 to 5
Insulation coated particle Yes
Main bonding conditions Temperature [℃] 170 to 200
Time [sec] 4 to 10
Pressure [MPa]*3 3 to 6
  • *1
    Minimum space: Space between adjacent circuits.
  • *2
    Please contact us for information on σ value control of the minimum connection area for each product individually.
  • *3
    Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.

Interconnection of ITO glass and FPC for large FPDs.


Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.