Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Board for large FPDs

Suitable for interconnection of COF and input boards (FOB) for large-sized FPDs.

  • Product name
    CP20000 series
  • Features
    • Unique adhesive composition with excellent performance for bonding 2 or 3 layer FPCs.

Structure

Specifications

Product name CP20000 series
Type FOB
Connection material COF/FPC
PWB
Minimum space [µm] *1 100～200
Minimum connection area [µm2]*2 100,000～150,000
Thickness [µm] 30～40
Conductive particles Type Nickel particle
or Au plating nickel particle
Particle diameter [µmФ] 3～6
Insulation coated particle -
Main bonding conditions Temperature [℃] 150～200
Time [sec] 4～10
Pressure [MPa] *3 2～5
  • *1Minimum space: Space between adjacent circuits.
  • *2Please contact us for information on σ value control of the minimum connection area for each product individually.
  • *3Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps.
  • 　The pressure at FOG, FOB and FOF bonding is described as the bonding area.

Application Example

Interconnection of PWB and FPC for large FPDs.

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

Product information

Optical Semiconductor

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