Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Board for large FPDs

Suitable for interconnection of COF and input boards (FOB) for large-sized FPDs.

  • Product name
    CP20000 series
  • Features
    • Unique adhesive composition with excellent performance for bonding 2 or 3 layer FPCs.



Product name CP20000series
Type FOB
Connection material COF/FPC
Minimum space [µm]*1 100 to 200
Minimum connection area [µm2]*2 100,000 to 150,000
Thickness [µm] 30 to 40
Conductive particles Type Nickel particle or Au plating nickel particle
Particle diameter [µmФ] 3 to 6
Insulation coated particle No
Main bonding conditions Temperature [℃] 150 to 200
Time [sec] 4 to 10
Pressure [MPa]*3 2 to 5
  • *1
    Minimum space: Space between adjacent circuits.
  • *2
    Please contact us for information on σ value control of the minimum connection area for each product individually.
  • *3
    Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.

Interconnection of PWB and FPC for large FPDs.


Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.