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- Anisotropic Conductive Film (ACF) for Film On Plastics for Touch panel
Anisotropic Conductive Film (ACF)
Anisotropic Conductive Film (ACF) for Film On Plastics for Touch panel
Suitable for interconnection of ITO Plastics and FPC.
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- Product name
- CP923CM-25AC/CP923AM-18AC
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- Features
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- Suitable for the fine pitch and thin connection.
- High adhesive to plastics materials.
- Acrylic resin is a major component of binder.
- High repairability. Low temperature and short-time bonding.
- A material having high adhesion to a plastic material, suitable for the connection of the film material subject to thermal influence.
Safety Data Sheet (SDS) Download
Related articles
Structure
Specifications
Product name | CP923CM-25AC | CP923AM-18AC | |
---|---|---|---|
Type | FOP | FOP | |
Connection material | FPC | FPC | |
ITO Plastics | ITO Plastics | ||
Minimum space [µm]*1 | 150 | 50 | |
Minimum connection area [µm2]*2 | 200,000 | 60,000 | |
Thickness [µm] | 25 | 18 | |
Conductive particles | Type | Au/Ni plating on a polymer core particle | Au/Ni plating on a polymer core particle |
Particle diameter [µmФ] | 20 | 10 | |
Insulation coated particle | No | No | |
Main bonding conditions | Temperature [℃] | 140 to 160 | 140 to 160 |
Time [sec] | 5 | 5 | |
Pressure [MPa]*3 | 0.5 to 4 | 2 to 4 |
- *1
Minimum space: Space between adjacent circuits. - *2
Please contact us for information on σ value control of the minimum connection area for each product individually. - *3
Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.
Interconnection of ITO Plastic substrates and FPC.
caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
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