History

Mar. 1962 Sony Chemicals Corporation Established.

Sony Corporation put the Japan's first transistor radio TR-55 on the market in 1955, which achieved significant downsizing with the use of transistors in place of existing vacuum tubes. The company also succeeded in developing a copper foil with adhesive for printed circuit board (PCB) for transistor radios jointly with Rubber and Asbestos Inc. in the United States (hereafter referred to as US R&A). The company imported this copper foil manufactured by US R&A and subcontracted the processing to a domestic PCB maker. However, in anticipation of the growing demand for transistor radios, the company signed a technical assistance contract with US R&A (later acquired by Pittsburgh Plate Glass Co.) to encourage domestic production. Then as a wholly-owned subsidiary of Sony Corporation for manufacturing and sales of copper foil products for circuits and industrial adhesive products, Sony Chemicals Corporation was founded.

Mar. 1963 Broke into the liquid adhesive domain to build up a new core business.

Sony Chemicals Corporation started production of Z782, a liquid adhesive for polyvinyl chloride (PVC) steel sheets with the opening of Haneda Plant. The company released Bondmaster "Tuff" for general-purpose adhesive for home use followed by a series of products including "Clear," "Epoxy" and "Vinyl." For industrial adhesives, as the certification of UL (Underwriters Laboratory) became mandatory for fixing of electronic parts in electrical appliances, chloroprene-rubber base flame retardant adhesive SC12N went on sale for fixing of electronic parts, so the company expanded the business in both domains, industrial use and home use. The next year the company also pushed into the industry of sealing materials for building materials.

Apr. 1964 The Primaster production line for printed circuits at the Haneda Plant was completed.

Production of the long-awaited copper foil with adhesive made in Japan started.

Apr. 1965 Expanded the application of bonding technologies to double coated tapes.

Sony Chemicals Corporation also moved into the double coated tapes industry. Following the introduction of home-use "Tuck Master," the industrial-use "Tuck Master" was also launched in 1967. Particularly the model #1477J introduced on the market in 1968 earned an excellent reputation, so it evolved into the later T4000 Series, which won a position as a standard option of high-performance double coated tapes.

Jan. 1970 Kanuma Plant No.1 completed.
Transferred from the Haneda Plant.

Mar. 1971 Adopted double coated tapes for sliding sheets and slack-preventing pads for U-matic tapes.

Mar. 1972 Started mass production of magnetic heads and ferrite cores.

Following the successful production of ferrite in monocrystalline form in 1964, Sony Corporation proceeded to manufacture tape recorder heads in response to the full-scale mass production of the home-use tape recorder Model TC-2850SD. They also started full-blown mass production of ferrite cores for television, in response to the demand for the manufacturing of "Trinitron" color TV Model KV-1310.

Jan. 1973 Tokai Electronics Corporation established.

Tokai Electronics Corporation established
(Renamed Sony Atsuta Corporation in April 1990).
Started production of printed circuits for Sony’s Trinitron color TV (CRTs).

Oct. 1973 Started integrated production of flexible printed circuit board (FPC) beginning from the selection of raw materials.

Sony Chemicals Corporation initiated the full-scale production of flexible printed circuit board (FPC) that contributed to the reduction in both size and weight of electronic devices. The following year the fine-pattern flexible printed circuit board for LCDs went on sale.

Mar. 1975 As a double coated tape for flexible printed circuit board (FPCs),
T4100 Series went on sale. This Series also has been well received as a standard option for a wide range of applications.

Jul. 1976 Started mass production of video deck heads for broadcasting and professional use.
(Video Magnetics Corporation was later integrated into Sony Precision Magnetics Corporation.)

Later, as more home-use audio equipment, TV sets and video equipment came into widespread domestic use, electronic devices that utilized magnetic heads and ferrite cores in particular, were successively supplied for Sony brand products.
The reliable, high-precision fabrication and assembly techniques as well as the thin-film technology that was developed around that time served as a foundation for the current electronic products and optical devices of ultra-fine nano-micron scale modules.

Dec. 1977 Took the initiative in commercialization of a hot technology, Anisotropic Conductive Film (ACF), in the industry.

As LCD panels for digital cameras and cellular phones and also the flat panel displays become widespread, the demand for LCD display devices is increasingly growing. Anisotropic Conductive Film (ACF) is indispensable for the evolution of LCD display devices. This year Sony Chemicals Corporation succeeded in commercializing the ACF before the rest of the industry.

Oct. 1985 Launched production of ink ribbon for thermal transfer printers.

Production of the TR4050 ink ribbon for thermal transfer printers used for printing of barcodes was started. Printing of barcodes especially used in merchandise logistic applications requires a higher level of clarity and durability, though the company has been meeting the stringent demands with proprietary engineering expertise, and the products have been used worldwide.

Jul. 1987 Listed on the Second Section of the Tokyo Stock Exchange (TSE).

Sony Chemicals Corporation went public in order to lead the public to a better understanding and a higher recognition of the proprietary advanced technologies.

Nov. 1987 Started production of "Lamicoil" for compact motors.

May. 1989 Started production of high-density thin multilayer printed circuit boards for the passport-sized camcorder Handycam® TR-55.

Tokai Electronics Corporation succeeded in developing the first consumer-use high-density thin multilayer printed circuit boards, which was designed to mount the 0.5 mm-pitch Quad Flat Package (QFP). It was incorporated in the passport-sized Handycam®, a hot-selling video camera, helping to downsize the camcorder.

Dec. 1989 The locally incorporated Sony Chemical Corporation of America (Chicago, Illinois) established.

A company has been pushing ahead with the manufacturing and sales of ink ribbon for thermal transfer printers in U.S.A. Started production of reflective layer protective coating material for optical disks in 1998.

May. 1990 Locally incorporated Sony Chemicals (Singapore) Pte. Ltd. established.

Started selling of adhesive tapes and adhesives for home and industrial use.

Nov. 1990 Sony Neagari Corporation Inc.

Sony Neagari Corporation was set up to expand the business of high-density multilayer printed wiring boards acting as one of the important key devices and to serve as the production base for onboard devices. Working in cooperation with the design team in Sony Corporation, Sony Neagari Corporation has been establishing a track record in circuit board wiring design and onboard device design.

Feb. 1992 Locally incorporated Sony Chemicals Europe B.V. established in Netherlands.

Started production and selling of ink ribbon for thermal transfer printers.

Apr. 1992 Pushed into the business of recording layer protection coating material for optical disks.

To keep up with the transition of recording media from tape to disk, Sony Chemicals Corporation developed and started selling of its SK3200 Series recording layer protection coating material for optical disks. The manufacturing know-how at this time frame was of much help in developing the SK6000 Series bonding materials for DVD lamination.

Apr. 1994 Locally incorporated Sony Chemicals (Suzhou) Co., Ltd. established in China.

Started production of printed circuit board.

Jul. 1994 Started production of protection element for Li-ion rechargeable battery.

As notebook-size personal computers, cellular phones, video cameras and other portable electronic equipment were coming out with reduced sizes and advanced features, the Li-ion rechargeable battery market expanded. Then Sony Chemicals Corporation succeeded in the world first mass production of protection elements that are essential to the safe operation of Li-ion batteries. Further in 1998, the company successfully developed the world's smallest size protection element Self Control Protector for Li-ion rechargeable batteries.

Apr. 1995 Became the first company to receive ISO14001 DIS
certification for the environmental management system from DNV (Det Norske Veritas).

The ISO standards prescribe stringent requirements for activities to maintain conformity even after acquisition of certification. Sony Chemicals Corporation became the first to obtain ISO14001DIS (Environmental Management System) certification. The same year the company acquired the certification of quality assurance standard ISO9001.

May. 1995 Started production of build-up printed circuit board (photo via hole type).

In response to the downsized design of Handycam®, Sony Neagari developed and put the build-up printed circuit board into production.

May. 1996 Started volume production of multilayer printed circuit board for PlayStation®.

Sony Neagari started volume production of multilayer printed circuit board that was incorporated in the home-use hand-held video game console PlayStation® first produced by Sony Computer Entertainment. In 2000, a multilayer printed circuit board for the PlayStation®2 was designed and it was adopted also in the PlayStation®Portable (PSP) in 2005.

Jun. 1996 Received the Tokyo Stock Exchange's Listed Company Disclosure Award.

Sony Chemicals Corporation became a recipient of the first Listed Company Disclosure Award granted by Tokyo Stock Exchange to honor companies who actively disclose their corporate information. The company was highly regarded for the solid information disclosed and readable descriptions.

Dec. 1997 Locally incorporated Sony Chemicals Indonesia established in Indonesia.

Started production and selling of flexible flat cable and flexible printed circuit board.

Apr. 1998 Started production of RCC-type laser build-up printed circuit board.

Jul. 1998 Developed environmentally friendly 2 layer polyimide circuit board.

In order to quickly answer the needs for a thinner printed circuit board in response to the downsizing and enhanced performance of electronic equipment, the flexible electronic circuit board "2 layer polyimide circuit board" was developed. The board was released as a halogen-free product, which eliminated adhesive layer based on the proprietary joining technique and contained no halogen that could emit harmful substances when incinerated.

Developed a variety of environmentally conscious products.

Sony Chemicals Corporation developed a wide range of eco-friendly products, including the halogen-free flexible flat cable (FFC), the solvent-less halogen-free double coated tapes G9000 which does not use any toluene, MEK and other organic solvents in the manufacturing process, and the Anisotropic Conductive Film (ACF) for environmentally conscious high-reliability semiconductor packages and COF. The company has been highly regarded for its environmental consciousness.

Started production of optical devices.

Due to the high recognition for element technologies concerning crystal formation, ultra-precision fabrication and thin-film deposition about ferrite and prism, the company started production of prisms for optical disks.

Jan. 2000 Sony Chemicals Corporation was delisted from TSE. Became a wholly-owned subsidiary of Sony Corporation.

May. 2000 Impedance control mounted on build-up printed circuit board (photo via hole type).

Oct. 2001 Started production of Touch panel.

Based on know-how accumulated over the years of manufacturing and production engineering of various devices, the company successfully introduced the film-glass resistive touch screens in 2001. Encouraged by a good reputation for stronger glass due to the adoption of a super-cutting design, the company made a full-scale entry into the touch screen market space. The touch screen products have been finding applications in the fields of PDAs, smart phones, and PNDs by a number of providers because of their well-balanced quality and reliability.
In addition, equipped with the additionally developed high transparency and low reflection film, the touch screens are well received as easy-on-the-eye displays.

Jan. 2002 Started selling of Anti-reflection film.

Sony Chemicals Corporation established the roll-to-roll sputtering system suited for volume production by applying the proprietary technology for Anti-reflection film for cylindrical CRTs, which had been developed by Sony Corporation.

Apr. 2002 Unification of Sony Chemicals Corporation and Sony Neagari Corporation.

Sep. 2002 Started selling of UV curable adhesive for optical pickup.

As recording media shifted from analog to digital formats and optical modules were coming out with higher resolutions, the demand for semiconductor modules grew. Driven by this trend, the UV curable adhesive for optical pickup was developed and went on sale.

Jan. 2004 Started production of high-density mounting double-sided flex-rigid printed circuit board.

The NORTH Corporation's NMBI (Neo Manhattan Bump Interconnection) technology was adopted and the high-density mounting double-sided flex-rigid printed circuit board was developed, and started production.

Aug. 2004 Started selling of thermal conductive sheet.

As integrated circuits are coming out with advanced features, protection against elevated temperatures. The thermal conductive sheet was developed to efficiently dissipate heat from circuit boards even if mounted in closed enclosures.

Feb. 2006 Development of lump-sum lamination Any Layer multilayer printed circuit board.

The H-SAT (High Speed transmission All layer via Thin PWB) lump-sum lamination Any Layer multilayer printed circuit board was developed, which could contribute to reduce both time-to-market and man-hours. It became possible to develop a lump-sum lamination circuit board using materials of low dielectric constant and low dielectric loss and to produce boards with excellent high-speed transmission features on short lead times.

Jul. 2006 Changed company name to "Sony Chemical & Information Device Corporation."

Unification of "Sony Chemicals Corporation" and "Sony Miyagi Corporation" and Changed company name to "Sony Chemical & Information Device Corporation."

Apr. 2007 Started production of the Optical elasticity resin (SVR®) to increase the visibility of the display panel.

The high contrast of mobile devices such as notebook PC and cellular phone by filling an optical elasticity resin with excellent optical properties between the front panel and display module. It has been adopted in a wide range of FPDs to the LCDs TV of smartphones, tablet PC from now.

May. 2008 Started production of Inorganic polarizer for projectors.

Our inorganic polarizer features inorganic material that enables high-durability for long-term use with devices such as projectors with a brightness of 3000 ANSI lumens or higher in high-temperature, high-luminance environments and realize high transmittance and low reflectance by the application of our nano-level processing technology and thin-film fine structuring, contributing to enhanced projector transmittance and contrast.
Such as 3LCD projection type front projectors, to be required downsizing and enhanced luminance.

Jul. 2008 Transferred thermal transfer ink ribbon business to Dai Nippon Printing Co., Ltd.

to News Release

Oct. 2009 Received the Minister of Economy, Trade and Industry’s Award during the "Resources Circulation Technologies and Systems awarding" of the Ministry of Economy, Trade and Industry.

In recognition of more than 12 years of production of industrial adhesive tapes that makes use of the UV curing technique in the coating process, eliminating the need for organic solvents.

Apr. 2010 Started production of Solar Cell Conductive Film.

Applying the technology of Anisotropic Conductive Film, developed Solar Cell Conductive Film in tabbing solar cells to replace the soldering.
The low temperature bonding at 180 °C, reduce the thermal strain and the color unevenness in the thinner cells.

Sep. 2012 Started production of Inorganic waveplate.

Precise multilayer thin film deposition technology, to form a birefringent multilayer film having a inclined column structure with high refractive index, to achieve high conversion efficiency and excellent transmittance. Inorganic waveplate that enable higher contrast in high-end projectors.

Oct. 2012 Changed company name to Dexerials Corporation, business was launched.

to News Release

Jan. 2013 Locally incorporated Dexerials (Shanghai) Corporation established in China.

Aug. 2013 Started production of PSA-Transformable optical elasticity resin (Hybrid SVR) that is transformed adhesion properties during UV curing.

While maintaining excellent optical properties of conventional SVR, which is known for its high visibility as well as abilities to improve contrast and shock-resistance, the new product realizes workability equivalent to that of optical clear adhesive and reduces color unevenness of display panel caused by shrinkage during curing.

May. 2014 Locally incorporated Dexerials Advanced Material (Suzhou) Co., Ltd. established in China.

Started production of Anisotropic Conductive Film (ACF) and Thermal conductive sheet.

Aug. 2014 Started production of Eye shield material for medical use.

Started production of eye shield material for medical use which has properties of low reflection and high transmission due to elimination of the refractive index fluctuation achieved by processing nano-level fine concavo-convex structures on the film surface. Entered into life science business.

Apr. 2015 Dexerials Kibou Corporation started business.

Started business as a "special subsidiary company" promoting employment of people with disabilities.

Apr. 2015 Started production of
Solar control window film "Albeedo"

New transparent heat shielding window film that reflects near infrared rays from the sun upwards. Albeedo blocks the heat generating near infrared rays from entering a room, reducing the increase in room temperature, but it also improves the thermal environment of the surrounding buildings as well. As a result, it contributes to the mitigation of the Urban Heat Island effect.

Jul. 2015 Listed on the First Section of the Tokyo Stock Exchange (TSE).

Jul. 2015 Started production of Water treatment agent suitable for Inorganic effluent.

Anionic water treatment agents for the treatment of inorganic effluent water utilizing characteristics of natural plants by applying technologies of organic material design and formulation. Having excellent coagulation, flocculation and dewatering performance with only one ingredient.

Sep. 2016 Our solar control window film "Albeedo" received the Good Design Award 2016.

Oct. 2016 Tochigi Plant started operations.

Positioned as a development and production base for new growth, started production and shipment of Anti-reflection film for notebook PCs as the first product in October 2016.

Dec. 2016 Commercialization of ArrayFIX, Particle-arrayed Anisotropic Conductive Film (ACF)

Particle-arrayed Anisotropic Conductive Film (ACF) featuring adhesion with minimum wiring space of 10μm. Conductive particles are arrayed at the target position using a binder that makes it difficult for the particles to move even during bonding. This allows a number of wires to be stably connected even in a narrow space.

May. 2017 Our solar control window film "Albeedo" received the Technology Award from the Heat Island Institute International.

Jun. 2018 Developed anti-fogging and anti-fouling solutions to prevent clouding and improve the ease of cleaning mirrors.

Jun. 2018 Development of the D5200 series, a Low-κ Interlayer Adhesive Thermosetting Tape that Bonds High-Speed Transmission FPCs at 180℃.
Supporting Next Generation High-Speed Transmission such as 5G Communication.

Aug. 2018 Development of Noise suppression thermal conductive sheet.
Carbon fiber type EX10000K3 series, Suitable for Noise Suppression and Heat Dissipation for IC Chips.

Sep. 2018 Achievement of Development to realize Pb-free Fuse Elements for Surface mounted Type Fuse Self Control Protector, and The Patent acquisition