Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Glass for Touch panel

Suitable for interconnection of ITO Glass and FPC.

  • Product name
  • Features
    • Unique adhesive composition with excellent performance for bonding 2 or 3 layer FPCs.



Product name CP806AM-16AC
Type FOG
Connection material FPC
Glass substrate
Minimum space[µm]*1 50
Minimum connection area [µm2]*2 60,000
Thickness [µm] 16
Conductive particles Type Au/Ni plating on a polymer core particle
Particle diameter [µmФ] 10
Insulation coated particle No
Main bonding conditions Temperature [℃] 170 to 200
Time [sec] 10
Pressure [MPa]*3 2 to 4
  • *1
    Minimum space: Space between adjacent circuits.
  • *2
    Please contact us for information on σ value control of the minimum connection area for each product individually.
  • *3
    Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.

Interconnection of ITO Glass and FPC.


Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.