Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized FPDs

Suitable for direct bonding of driver IC which drives a flat panel display onto substrate. With both excellent conductivity and insulating property between terminals for fine pitch interconnection.

  • Product name
    PAF300 series
  • Features
    • The particles arraying technique arrays conductive particles at the targeted positions and the particles immobilizing technique suppresses flow of them during the bonding provide stable particle capturing performance with a small number of particles.
    • Decreasing the number of conductive particles and immobilizing them reduces the risk of short-circuit for fine-pitch connections.
    • In interconnection of IC and a panel, it provides a minimum connection area of 400 µm2 and a minimum space of 5 µm.
    • 1.0 mm width available.

Product Lineup



Product name PAF300 series
Type COG
Connection material IC
LCD Glass substrate
Minimum space [µm] *1 5
Minimum connection area[µm2] *2 400
Thickness [µm] 16
Conductive particles Type Ni plating on a polymer particle
Particle diameter [µmФ] 3.2
Insulation coated particle Yes
Main bonding conditions Temperature [℃] 130 to 160
Time [sec] 5
Pressure [MPa] *3 40 to 80
  • *1Minimum space: Space between adjacent circuits.
  • *2Please contact us for information on σ value control of the minimum connection area for each product individually.
  • *3Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.

Interconnection of small-to-medium-sized FPDs and an IC chip.

1.Visual comparison during ACF



Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

Product Lineup