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- Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized FPDs
Anisotropic Conductive Film (ACF)
Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized FPDs
Suitable for direct bonding of driver IC which drives a flat panel display onto substrate. With both excellent conductivity and insulating property between terminals for fine pitch interconnection.
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- Product name
- CP692 series
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- Features
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- Both optimum conductivity in vertical and complete insulation in horizontal are possible by our unique insulating coating technology on conductive particle.
- A large number of bumps with fine pitch can be bonded at one time by an optimum thermal compression.
- High reliability by excellent Anti-migration feature.
- Efficient capturing performance of conductive particle and compatibility for fine-pitch application can be achieved by the 2 layer structure of ACF accommodates adhesive layer and non-conductive layer.
- Excellent conductive reliability.

Related articles
Structure

Specifications
Product name | CP692 series | |
---|---|---|
Type | COG | |
Connection material | IC | |
Glass substrate | ||
Minimum space [µm]*1 | 12 | |
Minimum connection area [µm2]*2 | 1,300 | |
Thickness [µm] | 20 | |
Conductive particles | Type | Au/Ni plating on a polymer core particle |
Particle diameter [µmФ] | 3 | |
Insulation coated particle | Yes | |
Main bonding conditions | Temperature [℃] | 190 to 210 |
Time [sec] | 5 | |
Pressure[MPa]*3 | 60 to 80 |
- *1Minimum space: Space between adjacent circuits.
- *2Please contact us for information on σ value control of the minimum connection area for each product individually.
- *3Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.
Interconnection of small-to-medium-sized FPDs and an IC chip.

caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
Products
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Anisotropic Conductive Film
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