Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Glass for small-to-medium-sized FPDs

Suitable for interconnection of small-to-medium-sized FPDs and film materials.

  • Product name
    CP133 series
  • Features
    • Unique adhesive composition with excellent performance for bonding 2 or 3 layer FPCs.
    • Both optimum conductivity in vertical and complete insulation in horizontal enable fine-pitch interconnections by our unique insulating coating technology on conductive particle.

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Structure

Specifications

Product Name CP133 series
Type FOG
Connection material TCP/COF/FPC
Glass substrate
Minimum space [µm]*1 25
Minimum connection area [µm2]*2 12,000
Thickness [µm] 18 or 25
Conductive particles Type Ni plating on a polymer particle
Particle diameter [µmФ] 4
Insulation coated particle Yes
Main bonding conditions Temperature [℃] 180 to 200
Time [sec] 8
Pressure [MPa]*3 3 to 5
  • *1
    Minimum space: Space between adjacent circuits.
  • *2
    Please contact us for information on σ value control of the minimum connection area for each product individually.
  • *3
    Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.

Application Example

Interconnection of small-to-medium-sized FPDs and film materials.

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

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Optical Semiconductor

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