Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Board / Film for alternative to connector and solder connection

Suitable for interconnection of rigid board and film materials or interconnection between film materials. The lineup includes types that can be stored at room temperature.

  • Product name
  • Features
    • Lower temperature profile and low height interconnection with fine pitch can be achieved by ACF connection for Flex on Board compare to mechanical connectors.
    • Excellent conductive reliability.
    • Pb-free compatibility for environmental-friendliness.

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Product name CP801AM-35AC
Connection material FPC
Minimum space [µm]*1 100
Minimum connection area [µm2]*2 100,000
Thickness [µm] 35
Conductive particles Type Au/Ni plating on a polymer core particle
Particle diameter [µmФ] 10
Insulation coated particle No
Main bonding conditions Temperature [℃] 180 to 200
Time [sec] 10 to 15
Pressure [MPa]*3 2 to 4
  • *1Minimum space: Space between neighboring circuits.
  • *2Please contact us for information on σ value control of the minimum connective area for each product individually.
  • *3Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB and FOF mounting is described as the bonding area.

Replacing connectors / soldering interconnect.


Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

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