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- Anisotropic Conductive Film (ACF) for Film On Board / Film for alternative to connector and solder connection
Anisotropic Conductive Film (ACF)
Anisotropic Conductive Film (ACF) for Film On Board / Film for alternative to connector and solder connection
Suitable for interconnection of rigid board and film materials or interconnection between film materials. The lineup includes types that can be stored at room temperature.
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- Product name
- CP850CG-35AJ
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- Features
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- Easily bonded using simple bonders such as solder bonding devices.
- Storable for 2 years at room temperature.
- Lower height interconnect can be achieved by ACF compare to mechanical connector.

Safety Data Sheet (SDS) Download
Related articles
Structure

Specifications
Product name | CP850CG-35AJ | |
---|---|---|
Type | FOB/FOF | |
Connection material | FPC | |
PWB | ||
Minimum space [µm]*1 | 100 | |
Minimum connection area [µm2]*2 | 200,000 | |
Thickness [µm] | 35 | |
Conductive particles | Type | Ag plating on a polymer core particle |
Particle diameter [µmФ] | 20 | |
Insulation coated particle | No | |
Main bonding conditions | Temperature [℃] | 110 to 140 |
Time [sec] | 3 to 7 | |
Pressure [MPa]*3 | 1 to 3 |
- *1
Minimum space: Space between adjacent circuits. - *2
Please contact us for information on σ value control of the minimum connection area for each product individually. - *3
Pressure of main bonding: The pressure at COG bonding is described as the total area of bumps. The pressure at FOG, FOB and FOF bonding is described as the bonding area.
Replacing connectors / soldering interconnect.

caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
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