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- Special resin base hotmelt double coated tapes
Double coated tapes
Special resin base hotmelt double coated tapes
For applications where strong adhesiveness is required, such as mutual adhesion of metal materials, and adhesion of a metal material and a plastic material.
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- Product name
- NP605
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- Features
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- The tape is tack-free at room temperature, enabling punching and spinning without release paper.
- Low-temperature heat activation type enables bonding at 90°C.
Safety Data Sheet (SDS) Download
Related articles
Structure
Specifications
| Product name | NP605 |
|---|---|
| Main component | Special resin base |
| Carrier | Nonwoven fabric |
| Color | Translucent white |
| Adhesive thickness(µm) | About 85 |
| Release paper thickness(µm) | About 60 |
| Bonding strength (N/40mm x 40mm) *1 |
250 |
| St'd size(width & length) | 400mm x 100m |
| Warranty period from manufacturing date | 12 months |
- *1 Cleavage strength to Aluminum / Polystyrene
Recommended bonding conditions: Temperature / 100°C to 140°C, Time / 8 sec to 15 sec, Pressure / 0.2MPa to 0.3MPa
For adhesion of Aluminum name plates, and metal and plastic materials.
1.Bonding strength on various bonding temperatures (Cleavage strength)
Test Piece Condition
Substrate:Aluminum plate(t=0.4mm) / Polystyrene plate(t=5mm)
Bonding area:40mm x 40mm
Bonding condition:Temperature 90°C to 140°C / Time 10 sec / Pressure 0.3MPa
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:20mm/min
[Left at RT for one hour before measurement]
Results
2.Reliability of bonding strength under different conditions (Cleavage strength)
Test Piece Condition
Substrate:Aluminum plate(t=0.4mm) / Polystyrene plate(t=5mm)
Bonding area:40mm x 40mm
Bonding condition:Temperature 90°C to 140°C / Time 10 sec / Pressure 0.3MPa
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed :20mm/min
[Left at RT for one hour before measurement]
Results
3.Bonding strength at different temperatures (Cleavage strength)
Test Piece Condition
Substrate:Aluminum plate (t=0.4mm) / Polystyrene plate (t=5mm)
Bonding area:40mm x 40mm
Bonding condition:Temperature 120°C / Time 10 sec / Pressure 0.3MPa
Peeling speed:20mm/min
[Left at RT for one hour and then at each temperature for 30 minutes before measurement]
Results
4.Shear strength at different temperatures
Test Piece Condition
Substrate:Stainless steel plate (t=0.5mm) / PC, ABS plate (t=5mm)
Bonding area:20mm x 20mm
Bonding condition:Temperature 90°C to 150°C / Time 10 sec / Pressure 0.3MPa
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed :20mm/min
[Left at RT for one day before measurement]
Results
caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
