Adhesive

Anisotropic Conductive Paste (ACP)

SA5000 Series: Thermosetting adhesives enabling space-saving adhesion and electric conduction

  • Product name
    SA5920HN
  • Features
    • Non-solvent single-component type curable resin.
    • Capable of fast curing (200°C, 1 sec. or longer), or low-temperature curing (125°C, 15 sec. or longer).
    • Ensuring excellent connection reliability.
    • An air jet dispenser can be used to apply this paste.

Specifications

Product name SA5920HN
Resin type Epoxy
Thermosetting condition (Recommend) *1 200°C / 1 sec. minimum
180°C / 2 sec. minimum
Viscosity [mPa・s] *2 10,000
Color Black opaque
Thixotropic index *2 5.6
Elastic modulus [MPa] *3 *4 3,000
Tg [℃] *3 *5 126
Storage temperature [℃] -40 to -15
  • *1: Adhesive temperature
  • *2: Rheo-meter
  • *3: Property after curing
  • *4: JIS K7244-4 compliant, DMS method:1 Hz@25°C
  • *5: ISO 11359-2 compliant

Application Example

Applications that require fast mounting of electronic components at low temperatures, such as mounting IC chips on RFID tags

Technical Data

Relationship between heating time and curing reaction ratio

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

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