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- Thermosetting tapes for FPC
Double coated tapes
Thermosetting tapes for FPC
Thermosetting tapes suitable for fixing of backing materials and terminals.
-
- Product name
- D3451/D3450
-
- Features
-
- Excellent resistance to heat from solder reflow after moisture absorption.
- Short curing time enables shorter processing time. Ideal for hot press, quick press and oven-curing.
- Storage at room temperature; easy handling.
- Initial tack enables tentative positioning.
Structure
Specifications
| Product name | D3451 | D3450 |
|---|---|---|
| Main component | Acrylic/Epoxy base | Acrylic/Epoxy base |
| Carrier | Non-carrier | Non-carrier |
| Color | White | White |
| Adhesive thickness(µm) | About 25 | About 35 |
| Release film thickness (µm) | About 38 | About 38 |
| Release paper thickness (µm) | About 130 | About 130 |
| Bonding strength(N/10mm) *1 | 25 | 31 |
| St'd size(width & length) | 500mm x 100m | 500mm x 100m |
| Warranty period from manufacturing date | 6 months | 6 months |
- *1 90 peeling strength to polyimide
- *Recommended curing conditions:
1.Quick press (Temperature / 160°C to 180°C Time/1 min to 2 min(vacuum time / 10 sec to 30 sec), Pressure/1MPa to 2MPa)→Oven curing (60 min at 140°C), - 2.Press(160°C, 60 min, 3MPa)
Ideal for fixing FPC stiffeners(glass epoxy, polyimide)that undergo heat treatment(e.g., solder reflow).
1.Bonding strength on various type of substrate (90° peeling)
Test Piece Condition
Tape width:10mm
Bonding condition:* Recommended curing conditions listed above
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:50mm/min
Backing material:CCL(=Copper Clad Laminate)
[Left at RT for one hour before measurement]
Results
(N/10mm)
| 90° peeling strength | Product name | Long press | Quick press and post cure | |||||||
|---|---|---|---|---|---|---|---|---|---|---|
|
CCL/ |
CCL/ GE |
CCL/ AL |
CCL/ SUS |
CCL/ PI |
CCL/ GE |
CCL/ AL |
CCL/ SUS |
|||
| D3451 | Normal | 21 | 22 | 15 | 16 | 25 | 23 | 15 | 16 | |
| After reflow | 21 | 22 | 15 | 16 | 25 | 23 | 15 | 16 | ||
| D3450 | Normal | 26 | 28 | 16 | 18 | 31 | 27 | 16 | 17 | |
| After reflow | 26 | 28 | 16 | 18 | 31 | 28 | 16 | 18 | ||
2.Solder reflow process heat resistance
Test Piece Condition
Substrate:Polyimide film
Bonding condition :* Recommended curing conditions and treatment before reflow process
(A) Dry processing:100°C 1 hour
(B) Moisture absorption processing:40°C 90%RH 96 hours
Solder reflow condition:Top 260°C (Reference profile)
Measuring condition:23°C±5°C 60%±20%RH
Backing material:CCL(=Copper Clad Laminate)
[Left at RT for one hour before measurement]
[Appearance after solder reflow process]
Results
| Heat resistance | Product name | Long press | Vacuum quick press and postcure | ||
|---|---|---|---|---|---|
| Dry | Moisture absorption | Dry | Moisture absorption | ||
| 1/100/-※ | 96/40/90※ | 1/100/-※ | 96/40/90※ | ||
| D3451 | 260°C pass | 260°C pass | 260°C pass | 260°C pass | |
| D3450 | 260°C pass | 260°C pass | 260°C pass | 260°C pass | |
- ※ Treatment condition: time (h) / temperature(°C) / humidity(%)
caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
