Double coated tapes

Thermosetting tapes for FPC

Thermosetting tapes suitable for fixing of backing materials and terminals.

  • Product name
    D3451/D3450
  • Features
    • Excellent resistance to heat from solder reflow after moisture absorption.
    • Short curing time enables shorter processing time. Ideal for hot press, quick press and oven-curing.
    • Storage at room temperature; easy handling.
    • Initial tack enables tentative positioning.

Structure

Specifications

Product name D3451 D3450
Main component Acrylic/Epoxy base Acrylic/Epoxy base
Carrier Non-carrier Non-carrier
Color White White
Adhesive thickness (µm) About 25 About 35
Release film thickness(µm) About 38 About 38
Release paper thickness (µm) About 130 About 130
Bonding strength (N/10mm) *1 25 31
St'd size (width & length) 500mm x 100m 500mm x 100m
Warranty period from manufacturing date 6 months 6 months
  • *1 90 peeling strength to polyimide
    Recommended curing conditions:
    ■Quick press
    (Temperature / 160°C to 180°C Time/1 min to 2 min(vacuum time / 10 sec to 30 sec), Pressure/1MPa to 2MPa)
    Oven curing: (60 min at 140°C)
    ■Press
    (160°C, 60 min, 3MPa)

Application Example

Ideal for fixing FPC stiffeners(glass epoxy, polyimide)that undergo heat treatment(e.g., solder reflow).

Technical Data

1.Bonding strength on various type of substrate (90° peeling strength)

90° peeling strength test

Test Piece Condition

Tape width: 10mm
Bonding condition: Recommended curing conditions listed above
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 50mm/min
Backing material: CCL(=Copper Clad Laminate)
[Left at RT for one hour before measurement]

Results

(N/10mm)

90° peeling strength Product name Long press Quick press and post cure
CCL/
PI		 CCL/
GE		 CCL/
aluminum		 CCL/
SUS		 CCL/
PI		 CCL/
GE		 CCL/
aluminum		 CCL/
SUS
D3451 Normal 21 22 15 16 25 23 15 16
After reflow 21 22 15 16 25 23 15 16
D3450 Normal 26 28 16 18 31 27 16 17
After reflow 26 28 16 18 31 28 16 18

2. Solder reflow process heat resistance

Test Piece Condition

構成： D3450/CCL or D3451/ポリイミド(7mil)
試験幅：10mm
圧着条件：推奨条件を使用(プレス機にて)
Measuring condition: 23°C±5°C 60%±20%RH
リフロー条件：以下温度プロファイルを参照。
[Left at RT for one hour before measurement]
[Appearance after solder reflow process]

Results
Heat
resistance		 Product name Long press Vacuum quick press and 
postcure
Dry
​		 Moisture
absorption		 Dry
​		 Moisture
absorption
1/100/- ※ 96/40/90 ※ 1/100/- ※ 96/40/90 ※
D3451 260°C pass 260°C pass 260°C pass 260°C pass
D3450 260°C pass 260°C pass 260°C pass 260°C pass
  • ※ Treatment condition: time (h) / temperature(°C) / humidity(%)

d3430_chart_01.gif

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

Product information

Optical Semiconductor

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