News Release 2014

2014.12.15 Event

Exhibit at 【16th IC PACKAGING TECHNOLOGY EXPO】

2014.11.13 Event

Exhibit at 【Shenzhen International Touchscreen Exhibition】

2014.10.29 New Product

Development of a Particle-Arrayed Anisotropic Conductive Film (ACF) for Chip on Glass (COG) connection with Minimum Bump space of 10µm

2014.10.17 Event

Exhibit at 【Display Innovation 2014】

2014.09.08 Event

Exhibit at 【2nd Film Tech Osaka】

2014.08.27 Event

Exhibit at 【SEMICON Taiwan 2014 】

2014.08.22 Event

Exhibit at 【International Touch Panel and Optical Film Exhibition 2014 (Touch Taiwan 2014) 】

2014.07.18 Event

Exhibit at 【TECHNO-FRONTIER 2014】

2014.05.29 Event

Exhibit at 【SID Display Week 2014 】

2014.04.01 Personnel affairs

Personnel Announcements

2014.03.24 Event

Exhibit at 【24th FINETECH JAPAN】