Exhibit at 【16th IC PACKAGING TECHNOLOGY EXPO】

Event

2014.12.15

Dexerials Corporation will be exhibiting the following products at Booth No. East 41-28 at the 【16th IC PACKAGING TECHNOLOGY EXPO】 to be held at Tokyo Big Sight Japan January 14–16, 2015.
We will wait for your coming.

Our exhibition products

1.Particle-arrayed Anisotropic Conductive Film (ACF) [Under development]
2.UV curable Anisotropic Conductive Film (ACF) [Under development]
3.3D-IC Bonding film [Under development]
4.Thermal conductive sheet / tape
5.Thermal conductive sheet Carbon fiber type [Prototype / Under development]
6.Thermosetting tapes for FPC (Conductive adhesive type) [NEW]
7.Anisotropic conductive adhesive “LEP series” [Prototype]

Session Program

【16th Printed Wiring Boards Expo】 Technical Conference Program
〔PWB-2〕Japan's Material and Evaluation Technology Supporting World's Electronic Devices

“Dexerials New Technology Trend of Anisotropic Conductive Film for Display”
～UV curable ACF / Particle-arrayed ACF～

Masao Saito
General Manager
Products Development Dept., Advanced Material Div.,
Dexerials Corporation

Date : Jan. 14[Wed], 2015 13:30-16:00

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