Thermal conductive sheet

Thermal conductive sheet High performance and insulation type

Insurated type with oriented boron nitride as a filler. Our originally developed orientation technology achieves both high thermal conductivity and flexibility.

  • Product name
    ZX11N series
  • Features
    • Thermal conductivity: 11 W/m-K, Hardness: 50 - 60 (Shore OO)
    • Our unique Boron Nitride orientation technology achieves both excellent thermal conductivity and Highly flexiblity.
    • Even though all the raw materials are insulators, it has excellent thermal conductivity and quickly transfers heat to heat sinks.
    • Compared to general thermal conductive pad that are highly filled with spherical fillers, it can maintain high flexibility and heat dissipation reliability.



Product name ZX11N series Remarks
Features High flexible; Insulation -
Thermal conductivity (W/m·K) 11 Estimated bulk
thermal conductivity
Main component Silicone -
Color White -
Hardness*1 50 - 60 Shore OO
ASTM D2240
Available thickness (mm)*2 0.3 - 3.0
Increments of 0.1
Specific gravity 2.3 -
Volume resistance (Ω・cm) - JIS K7194
Volume resistance (Ω・cm) 1.0x10 13 JIS K6911
Flame retardance V-0 UL94
File No.E63260
  • *1Hardness is measured by stacking the sheets to a thickness of 10 mm or more.
  • *2Thickness of only a thermal conductive sheet. A release film is not included.

Effective in heat conduction for IC chip, LED substrate and power supply.

Relationship between thermal resistance, compression ratio and pressure

Test Piece Condition

Sheet area: 3.14cm2
Measuring condition: 23°C±5°C 60%±20%RH
Thermal conductive sheet temperature: 40°C
Unit of thermal resistance: °C・cm2/W



Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.