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Thermal conductive sheet
Thermal conductive sheet Standard type
Standard type featuring high thermal conductivity and flexibility that rapidly conveys heat to heat sinks.
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- Product name
- EX30000 series
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- Features
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- Thermal conductivity：3 W/m·K, Hardness：50（Shore OO）
- Features high thermal conductivity, enabling rapid conveyance of heat to heat sinks.
- Moderate hardness realizes high workability.
- 低分子シロキサンガスの揮発が少なく、長期に使用しても基板などの接点障害が起きにくい。
- Halogen-free with high levels of flame resistance.
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Structure
Specifications
| Product name | EX30000 series | Notes |
|---|---|---|
| Main component | Silicone | - |
| Color | Off-white | - |
| Available thickness (mm)*1 | ≧ 0.5 Increments of 0.5 |
- |
| Hardness *2 | < 50 | Shore OO ASTM D2240 |
| Thermal conductivity (W/m·K) | 3 | Estimated thermal conductivity |
| Flame retardance | V-0: ≧ 2.5 mm V-1: 0.5 - 2.0 mm |
UL94 File No. E63260 |
- *1Thickness of only a thermal conductive sheet. A release film is not included.
- *2Hardness is measured by stacking the sheets to a thickness of 10 mm or more.
Effective in heat conduction for IC chip, LED substrate and power supply.
Relationship between thermal resistance, compression ratio and pressure
Test conditions
Sheet area: 3.14cm2
Measuring condition: 23°C±5°C 60%±20%RH
Thermal conductive sheet temperature: 55°C
Unit of thermal resistance: °C･cm2/W
Results
caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
Product information
Optical Semiconductor
