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Sputtering
Sputtering targets for Optical devices
Optical film targets that achieve high productivity and high reliability.
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- Product name
- Oxygen-deficient titanium oxide (TiO2) target
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- Features
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- By reducing the resistance of the oxide target, high-rate sputtering (approximately twice that of oxygen reactive sputtering) is achieved with DC sputtering.
- Our unique hot pressing technology allows us to create homogeneous, high-density targets.
- A high bonding rate with the backing plate ensures stable cooling efficiency.
Specifications
| Product name | Oxygen-deficient titanium oxide (TiO 2) target |
|---|---|
| Specific resistance (Ω・cm) | <0.1 *DC sputtering is possible |
| Density ratio (%) | 99≦ |
For forming high refractive index films
1. Film formation rate test
Test conditions
Sputtering power supply: DC 5.1W/cm 2
Target size: φ50mm
T/S distance: 80mm
Process gas: Ar + O 2 = 100 sccm
Gas pressure: 0.24Pa
Circuit board: B270 (Schott)
Ultimate vacuum pressure: ~10-5 Pa
Results
2. Oxygen partial pressure dependency test
Test Piece Condition
Sputtering power supply: DC 5.1W/cm 2
Target size: φ50mm
T/S distance: 80mm
Process gas: Ar + O 2 = 100 sccm
Gas pressure: 0.24Pa
Circuit board: B270 (Schott)
Ultimate vacuum pressure: ~10-5 Pa
Results
- *Refractive index n=2.3 or more at oxygen partial pressure of 1.5% or more (at 550 nm)
- *Extinction coefficient k≦ 5x10-3 or less at an oxygen partial pressure of 3.0% or more
caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
Product information
Optical Semiconductor
