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- Special resin base hotmelt double coated tapes
Double coated tapes
Special resin base hotmelt double coated tapes
For applications where strong adhesiveness is required, such as mutual adhesion of metal materials, and adhesion of a metal material and a plastic material.
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- Product name
- NP608
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- Features
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- Punching and bending possible after lamination to materials such as Aluminum and removal of release paper.
- 90°C で貼り合わせ可能な低温活性タイプ。
- It can be stored at RT, ensuring easy handling.
Structure
Specifications
| Product name | NP608 |
|---|---|
| Main component | Special resin base |
| Carrier | Non-carrier |
| Color | Translucent white |
| Adhesive thickness (µm) | About 50 |
| Release paper thickness (µm) | About 60 |
| Bonding strength(N/40mm x 40mm)*1 | 240 |
| St'd size (width & length) | 400mm x 100m |
| Warranty period from manufacturing date | 12 months |
- *1 Cleavage strength to aluminum foil/ABS
Recommended bonding condition: Temperature / 100°C to 140°C, Time / 8 sec to 15 sec, Pressure / 0.2MPa to 0.3MPa
For adhesion of Aluminum name plates, and metal and plastic materials.
1. Bonding strength at different temperatures (180° peeling)
Test Piece Condition
Substrate: ABS plate
Tape width: 20mm
Bonding condition: Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 100mm/min
Backing material: 50µm aluminum foil
[Left at RT for 30 minutes and then at each temperature for 30 minutes before measurement]
Results
2. Bonding strength at different temperatures (Cleavage strength)
Test Piece Condition
Substrate: Aluminum plate (t=0.4mm) / ABS plate (t=5mm)
Bonding area: 40mm x 40mm
Bonding condition: Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 20mm/min
[Left at RT for one day and then at each temperature for 30 minutes before measurement]
Results
3. Reliability of bonding strength under different conditions (Cleavage strength)
Test Piece Condition
Substrate: Aluminum plate (t=0.4mm) / ABS plate (t=5mm)
Bonding area: 40mm x 40mm
Bonding condition: Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 20mm/min
[Left at RT for one day and then at each temperature for 30 minutes before measurement]
Results
4. Initial Bonding strength against different types of substrate (Cleavage strength)
Test Piece Condition
Substrate: Aluminum plate (t=0.4mm) / ABS plate (t=5mm)
Bonding area: 40mm x 40mm
Bonding condition: Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 20mm/min
[Left at RT for one day and then at each temperature for 30 minutes before measurement]
Results
5. Bonding strength at different bonding temperatures(Cleavage strength)
Test Piece Condition
Substrate: Aluminum plate (t=0.4mm) / ABS plate (t=5mm)
Bonding area: 40mm x 40mm
Bonding condition: Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 20mm/min
[Left at RT for one day and then at each temperature for 30 minutes before measurement]
Results
6. Shear strength at different temperatures
Test Piece Condition
Substrate: SUS plate (t=0.5mm) / PC, ABS plate (t=5mm)
Bonding area: 20mm x 20mm
Bonding condition: Temperature / 90°C to 150°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 20mm/min
[Left at RT for one day before measurement]
Results
caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
Product information
Optical Semiconductor
