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Case study of adhesives | Automotive sensing camera
- High-precision Adhesion and Bonding Technology That Supports Sensing Essential to Autonomous Driving
- Automotive sensing cameras essential to autonomous driving consist of lenses (lens units) and image sensors. The cameras require μm-order bonding precision during assembly and long-term durability to avoid misalignment after adhesion. It is also critical that the adhesive quickly cures at low temperature and is easy to handle in order to streamline customers’ production.
Adhesives from Dexerials provide solutions that meet a variety of needs, as well as precise bonding, during the assembly of automotive sensing cameras.
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Application
Bonding with micron-order precision
The active alignment method enables the development and high-precision bonding of camera modules expected to have high sensing precision. The application of this method is supported by high bonding precision achieved through adhesive design in light of bonding processes, such as volume shrinkage, during adhesion response.
Proposals bearing the actual use environment in mind
Dexerials provides adhesion solutions that ensure stability under a wide range of conditions, considering heat resistance based on the conditions inside a car on a hot summer day and resin degradation over long-term use in addition to shock and vibration during driving.
Lineup of products with functions for various needs
Solutions suitable for materials and applications can be used during development as Dexerials offers a product lineup including a high-strength adhesive that cures with both heat and ultraviolet (UV), an adhesive with less shrinkage after curing, and a low-temperature adhesive.
Product characteristics
Stable bonding through thermo-curing
In thermo-setting adhesives, heat causes the cross-linking reaction among molecules to progress. Once the adhesives cure, the properties remain unchanged even if they are reheated. This cross-linking structure is robust and stable. It provides superior heat resistance and contributes to the improvement of chemical resistance and humidity resistance.
Epoxy-cationic polymerization adhesive with little cure shrinkage suitable for precise bonding
Epoxy-cationic polymerization adhesives produce cured materials with a structure mainly consisting of ether linkages. As a result, these adhesives have very small cure shrinkage and are excellent for precise bonding. This makes them suitable for applications that require micron-order bonding precision, such as image sensor cap encapsulation.
Hybrid curing technology that achieves both fast setting and high strength
Hybrid curing technology provides adhesion solutions that combine the fast setting property of UV-curable acrylic (radical polymerization system) and the superior adhesive strength of thermo-setting epoxy. As the adhesives cure at low temperature, productivity and reliability can both be achieved at once.
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Optical Semiconductor
