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Case study of Introduction of smart cards | Anisotropic Conductive Film (ACF)
- Low-temperature Mounting Solution to Improve the Electrical Connection Reliability of IC Chips
- The excellent connection reliability of anisotropic conductive film (ACF) from Dexerials allows you to mount IC chips onto various types of cards. It contributes to the spread and enhanced reliability of next-generation smart cards by, for example, adding a biometric authentication function to contactless cards.
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Application
Stable connection of IC chips
The ACF for smart cards is a film-type conductive adhesive with a wide bonding face developed for cards. This adhesive achieves stable connection reliability by ensuring a large adhesion area between the IC chip and the circuit.
Inclusion of a biometric authentication function to enhance card security
Connection to multiple circuits and fixation of modules are achieved at the same time by bonding a piece of ACF of the necessary shape to a biometric card equipped with multiple terminals connected to fingerprint authentication sensors through thermal compression.
Reduction in materials and equipment costs
If you have chip connection equipment for cards, you can immediately use ACF to produce contact and contactless cards. Unlike conventional soldering, where solder, hot-melt tape, and so on are used, ACF does not require special equipment, reducing manufacturing costs.
Product characteristics
Single product achieving adhesion, conduction, and insulation
Using conductive particles arranged inside resin, ACF conducts electricity while adhering the IC chip and the circuit, and, at the same time, insulates adjacent terminals from each other by itself.
Quick compression bonding at low temperature
When mounting on smart cards, the compression bonding time per cycle is limited to around 0.5 to 1.5 seconds to prevent thermal deformation of the cards. This compression is performed two to four times to ensure sufficient heat for the connection.
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Optical Semiconductor
