Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for smart cards

Anisotropic Conductive Film (ACF) optimized for the embedding of functional modules such as dual interfaces and fingerprint sensors in contact/contactless smart cards

  • Product name
  • Features
    • Performs mounting functional modules by adhesion and forming electrical conduction (electric circuits) simultaneously on substrates with low heat-resistance such as PVC, PC, and PET-G.
    • Using ACFs as module-embedding materials instead of solder or Ag paste reduces the number of processes and improves production efficiency.
    • Modules can be embedded on dual interface cards and smart cards with fingerprint identification by using typical equipment (milling and embedding apparatuses) commonly used in smart card assembly processes.



Product name EH1038-40
Connection materials Dual interface module, Fingerprint sensor module
Card substrate (such as PVC, PC, and PET-G)
Standard length [m] 100
Standard width [mm] 29 / 29.5
Thickness [µm] 40
Conductive particles Type Silver-plated copper particles
Mean particle diameter [µm] 38
Pasting conditions Temperature [℃] 120 to 150*1
Time [sec] 1.5 to 3.0
Pressure [N/module] 3.0 to 20
Bonding conditions Temperature [℃] 120 to 160*1
Time [sec] 0.5 to 1.2*2
Pressure [N/module] 60 to 120*3
Storage condition At room temperature
Shelf life Two years after production
  • *1Temperature of ACF
  • *2each step
  • *31.5 - 3.5 bar

For the embedding of functional modules such as dual interfaces and fingerprint sensors in Contact/contactless smart cards

Contact/contactless smart cards

Other than these, ACFs for connecting terminals of smart card display modules and battery modules are available. Please feel free to contact us.


Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.