Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Plastics for Touch panel

Suitable for interconnection of ITO Plastics and FPC.

  • Product name
    CP923CM-25AC/CP923AM-18AC
  • Features
    • Suitable for the fine pitch and thin connection.
    • High adhesive to plastics materials.
    • Acrylic resin is a major component of binder.
    • High repairability. Low temperature and short-time bonding.
    • A material having high adhesion to a plastic material, suitable for the connection of the film material subject to thermal influence.

Structure

Specifications

Product name CP923CM-25AC CP923AM-18AC
Type FOP FOP
Connection material FPC FPC
ITO Plastics ITO Plastics
Minimum space [µm]*1 150 50
Minimum connection area [µm2]*2 200,000 60,000
Thickness [µm] 25 18
Conductive particles Type Au/Ni plating on a polymer core particle Au/Ni plating on a polymer core particle
Particle diameter [µmФ] 20 10
Insulation coated particle No No
Main bonding conditions Temperature [℃] 130 to 160 130 to 160
Time [sec] 5 to 10 5 to 10
Pressure [MPa]*3 0.5 to 4 0.5 to 4
  • *1Minimum space: Space between neighboring circuits.
  • *2Please contact us for information on σ value control of the minimum connective area for each product individually.
  • *3Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB and FOF mounting is described as the bonding area.

Interconnection of ITO Plastic substrates and FPC.

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.