Exhibit at 【18th IC PACKAGING TECHNOLOGY EXPO】
Dexerials Corporation will be exhibiting the following products at Booth No. W2-14 at the【18th IC PACKAGING TECHNOLOGY EXPO】to be held at Tokyo Big Sight Japan January 18–20, 2017. We will wait for your coming.
Our exhibition products
1.Particle-arrayed Anisotropic Conductive Film (ACF) “ArrayFIX” [NEW]
2.Film type underfill (NCF) for 3D-IC assembly
3.Anisotropic conductive adhesive LEP series
4.Thermal conductive sheets