Dexerials Corporation will be exhibiting the following products at Booth No. 2Q05 at the 【NEPCON China 2016】 to be held at Shanghai World Expo Exhibition & Convention Center from April 26–28, 2016.
We will wait for your coming.

NEPCON China 2016 official site

1.Film type underfill (NCF) for 3D-IC assembly
2.Anisotropic conductive adhesive “LEP series”
3.Thermal conductive sheet Carbon fiber type [Conventional products and Under development]
4.Phosphor sheet

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