Exhibit at 【17th IC PACKAGING TECHNOLOGY EXPO】
Dexerials Corporation will be exhibiting the following products at Booth No. E57-42 at the【17th IC PACKAGING TECHNOLOGY EXPO】to be held at Tokyo Big Sight Japan January 13–15, 2016.
We will wait for your coming.
Our exhibition products
1.Film type underfill (NCF) for 3D-IC assembly
2.Anisotropic conductive adhesive “LEP 3000 series”
3.Thermal conductive sheet [Conventional products and Under development]
4.Thermal conductive sheet Carbon fiber type [Conventional products and Under development]
5.Thermal conductive adhesive tapes