- News Release
- Exhibit at 【15th IC PACKAGING TECHNOLOGY EXPO】
Exhibit at 【15th IC PACKAGING TECHNOLOGY EXPO】
Dexerials Corporation will be exhibiting the following products at Booth No. EAST 43-21 at the 【15th IC PACKAGING TECHNOLOGY EXPO】 to be held at Tokyo Big Sight Japan January 15-17, 2014.
We will wait for your coming.
Our exhibition product
1.3D-IC Bonding film [Under development]
2.Anisotropic Conductive Film (ACF) [Prototype]
3.Anisotropic conductive adhesive “LEP series” [Prototype]
4.Thermal conductive sheet
5.Thermal conductive adhesive transfer tapes
6.Thermal conductive carbon fiber sheet [Prototype]
7.Conductive adhesive thermosetting tapes [Prototype]
8.Thermal conductive thermosetting tapes [Under development]
9.Thermosetting tapes for FPC
10.Phosphor sheet [Prototype]