Exhibit at 【14th IC PACKAGING TECHNOLOGY EXPO】

Event

2012.12.17

We exhibit to 【14th IC PACKAGING TECHNOLOGY EXPO January 16th - 18th, 2013 held with Tokyo Big Sight (Japan) . Booth No. EAST 28-2】
We will wait for your coming.

Our exhibition products

1.Anisotropic Conductive Adhesive “LEP series”
2.Thermal conductive sheet
3.Thermal conductive adhesive transfer tapes
4.Thermal conductive carbon fiber sheet (Prototype)
5.Thermal diffusion graphite sheet (Prototype)
6.3D-IC bonding film (Under development)
7.Electro conductive thermosetting adhesive sheet (Under development)

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