Recently, transaction volumes processed at communication base stations and data centers have increased rapidly with the practical application of 5G communications. In addition, electronics devices and automobiles are becoming increasingly sophisticated and high performance, which is requiring that greater volumes of information be processed by IC chips. In response to this large volume of information being processed, information processing capacity has been improved by heightening the operating frequency of IC chips and the number of core processors. However, since IC chips, which are a semiconductor, have their own resistance, their operation generates heat, and coping with this problem is already a big challenge.
The thermal conductive sheet efficiently releases heat by filling the gap between an IC chip, which generates the heat, and a heat sink, etc., which dissipates it. Therefore, the thermal conductive sheet is required to have high thermal conductivity and flexibility for cohesion and level difference absorption. However, since use of a lot of materials (fillers) having high thermal conductivity will harden the whole sheet, thermal conductivity and flexibility are generally in a trade-off relationship.

• Thermal conductive sheet Silicone type ZX11N

• Satisfies both high thermal conductivity and flexibility using unique alignment technology
  Achieves high thermal conductivity by arranging boron nitride fillers that have different thermal conductivity aligned in respective directions by using the unique alignment technology Dexerials has developed in the thermal conductive sheet carbon fiber type . Able to reduce the amount of filler used, which satisfies both the thermal conductivity of 11W/m・K and flexibility (hardness) of 55 (Shore OO, ASTM D2240).
• Holding High Reliability by Employing Boron Nitride Fillers
  By using the boron nitride that has long-term stability as the filler, the entire thermal conductive sheet achieves high reliability with less deterioration and performance degradation even after extended use. Suitable for heat dissipation for IC chips for communication base stations, data centers, and automobiles, which are required to have long-term reliability.
• The whole sheet achieves high electrical insulation.
  Since both the silicone of the base material and the boron nitride of the filler have electrical insulation, the whole sheet has high electrical insulation with a dielectric breakdown voltage of 7 AC KV/mm (ASTM D149). Available without consideration for contacts with terminals at the periphery of IC chips
• Complies with environmental standards
  The product complies with the RoHS Directive environmental standards in Europe, selecting materials by utilizing the material mixing technology Dexerials has developed. This eco-friendly product is also entirely halogen free.

Product Name	ZX11N	Our conventional product EX50000	Remarks
Thermal conductivity (W/m・K)	11	5	Estimated bulk thermal conductivity
Main component	Silicone	Silicone	-
Color	White	Gray	-
Hardness*1	50 - 60	40 - 55	Shore OO ASTM D2240
Available thickness (mm)*2	0.3 - 3.0	0.5 - 3.0	-
Specific gravity	2.3	3.0	-
Dielectric breakdown voltage (AC KV/mm)	＞ 7	＞ 3	ASTM D149
Flame resistance	V-0	V-0	UL94 File No.E63260

• *1 Measured by laminating sheets by 10mm or higher
• *2 Thickness of the thermal conductive sheet only, not including the release film. Please contact us for any inquiries about a thickness out of the range.

In addition to this product, Dexerials's product lineup includes a carbon fiber type featuring high-end thermal conductive sheets with high thermal conductivity, and can provide products that are suitable for your application and use section. We will continue to provide new solutions in areas where technological innovation is advancing, as with this product, which is suitable for heat dissipation for IC chips in charge of information processing for high-speed communications and self-driving, etc.

Click here for corporate profile

Click here for any inquiy about this announcement