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- [Under development] Low-κ thermosetting tape for FPCs
[Under development] Low-κ thermosetting tape for FPCs
Bonding sheet for high-speed transmission FPCs that can be used for both liquid crystal polymer (LCP) and modified polyimide (M-PI)
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- Product name
- D5300P series
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- Features
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- Low transmission loss due to low dielectric constant
- The product can be used for both LCP and M-PI that are used for base material for high-speed transmission FPCs.
- Existing FPC manufacturing equipment can be used because the tape thermally cures at 180℃.
- This Novel formulation optimizes low dielectric constant with a high bonding strength. This technology enables the manufacture of highly reliable FPCs.
Structure
Specifications
| Product name | D5310P series | D5320P series | Note | |
|---|---|---|---|---|
| Type | High-bonding strength type | High-heat resistant type | ||
| Cover film thickness (μm) | 38 | Transparent | ||
| Adhesive thickness (μm) | 25 | Customize 12-50 (μm) | ||
| Release PET thickness (μm) | 38 | White | ||
| Bonding strength (N/10mm) | 13 | 10 | 90° peeling strength to copper foil | |
| Heat resistance | 260℃ Pass | 288℃ Pass | ||
| Standard size (width & length) | 250mm×100m 500mm×100m |
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| Dielectric properties | Dielectric constant (κ) | 2.34 | 2.36 | ASTMD2520 (JISC2565),10GHz |
| Dielectric dissipation factor (DF) | 0.0028 | 0.0028 | ASTMD2520 (JISC2565),10GHz | |
It is suitable for both interlayer bonding of LCP-based FPC for high-speed transmission of 6 GHz or higher used for 5G communication and M-PI-based FPC for high-speed transmission of 6 GHz or lower.
1.Dielectric properties
| D5310P series | D5320P series | Liquid crystal polymer (LCP) | ||
|---|---|---|---|---|
| Initial values | Dielectric constant(κ) | 2.34 | 2.36 | 3.0 - 3.4 |
| Dielectric dissipation factor(DF) | 0.0028 | 0.0028 | 0.002 - 0.0023 | |
| After aging at 40℃ /90%/96-hour | Dielectric constant(κ) | 2.35 | 2.36 | 3.0 - 3.4 |
| Dielectric dissipation factor(DF) | 0.0028 | 0.0028 | 0.002 - 0.0023 | |
2.Transmission loss
Testing conditions
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- Microstrip line length
- 100mm
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- Impedance
- 50Ω
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- Signal line thickness
- 18μm
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- Dielectric thickness
- 100μm
Simulation data
- * Simulation by Dexerials, using properties of a typical liquid crystal polymer (LCP)
caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.