Exhibit at 【3rd FPD Components & Materials EXPO】



We exhibit to 【3rd FPD Components & Materials EXPO April 16th-18th, 2008 held with Tokyo Big Sight (Japan). Booth No.EAST 39-27】 We will wait for your coming.


Our exhibition product

1.Anisotropic Conductive Film (ACF)
2.Flex-Rigid printed circuit board
3.Flexible printed circuit board
4.Elastic optical resin (Super View Resin)
5.Antireflection film
6.Touch panel
7.Removable type double coated tapes/Low VOC double coated tapes
8.Thermal conductive sheet/Thermal conductive adhesive transfer tapes
9.Adhesive tapes for suitable for securing EMC shilding
10.Thermosetting tapes for FPC/Heat resistance adhesive transfer tapes for FPC
11.PET carrier type double coated tapes/Impact force resistant type double coated tapes/Strong adhesive type double coated tapes
12.Polyester resin base hotmelt transfer tapes (non-carrier type)