Innovation solutions for
cost-efficient optimization
of smart card
Innovation solutions for
cost-efficient optimization
of smart card
Dexerials’ ACF for smart cards is a superior solution as it can connect to multiple circuits and secure modules by simply thermo-compressing the film-like material to the terminals. Additionally, the use of solder particles for circuit connection ensures good continuity over a long period of time.
ACF is a film-type conductive adhesive with uniformly dispersed conductive particles, enabling conduction vertically and insulation between is widely used for connecting substrates.
Innovation
Our ACF technology is designed to keep up with the ever-changing landscape of the electronics industry, ensuring that your products are always ahead of the curve.
Cost Reduction
By using our ACF for smart cards, you can reduce your production costs without compromising quality or reliability.
Optimization
ACF's optimization solutions help streamline your production process. This saves time and resources, increases production, and improves profitability.
Advantages of using ACFs
in IC chip mounting during card manufacturing
Product Lineup
EH2035H-40
Storage condition : At room temperature
Shelf life : Two years after production