Maximize
IC performance
Sheet materials that transfer heat generated by IC chips,
such as CPUs, to the heat sink to protect the device from heat.
Maximize
IC performance
Sheet materials that transfer heat generated by IC chips,
such as CPUs, to the heat sink to protect the device from heat.
Product Lineup
Silicone Sheet with Carbon Fibers
Filled with carbon fibers to silicone binder
and aligning the same direction.
| Product name | Bulk thermal conductivity | Hardness | Available thickness | |
|---|---|---|---|---|
| Remarks | (W/m·K) ASTM D5470 |
Shore OO ASTM D2240 |
(mm) | |
| EX20000C4S series | 40 | 70 - 80 | 0.3, 0.4, 0.5 | |
| EX20000C9 series | 40 | 50 - 60 | 0.5 - 3.0 | Increments of 0.5 |
| EX20000CX series | 38 | 75 - 85 | 0.1 | |
| EX20000C9S series | 35 | 20 - 35 | 1.5 - 3.0 | Increments of 0.5 |
| EX10000F7 series | 30 | 50 - 60 | 0.5 - 3.0 | Increments of 0.5 |
| EX20000NC series | 20 | 40 - 60 | 1.0 - 3.0 | Increments of 0.5 |
| EX10000NC series | 10 | 40 - 50 | 1.0 - 3.0 | Increments of 0.5 |
Silicone Sheet with Boron Nitride Flakes
Filled with boron nitride flakes to silicone binder
and aligning the same direction.
| Product name | Bulk thermal conductivity | Hardness | Available thickness | |
|---|---|---|---|---|
| Remarks | (W/m·K) ASTM D5470 |
Shore OO ASTM D2240 |
(mm) | |
| ZX11N series | 11 | 50 - 60 | 0.3 - 3.0 | Increments of 0.1 |
Performance test of the thermal conductive sheets
in a smartphone
* Benchmark Software : AnTuTu Benchmark v6.2
Comparison of Thermal grease and
Thermal conductive sheet
Compressibility change
in high temperature storage test
Test conditions
Storage temp : 150℃
Test item : Compressibility in 3 kgf/cm² loaded
Specimen : φ20mm×2mmt
Remarks : The ZX11N used in the evaluation was formulated to have the same thermal conductivity as
aluminum-nitride filler-filled products by adjusting the amount of boron-nitride flakes.
Applications
-
Data center
- Spine and Leaf
Switching IC
- Spine and Leaf
-
Base station
- ASIC
- FPGA
- Antenna amplifier
-
Optical transceiver
- QSFP-DD
- Silicon PIC
- DSP
-
Supercomputer
- CPU
- GPU