Maximize
IC performance
Sheet materials that transfer heat generated by IC chips,
such as CPUs, to the heat sink to protect the device from heat.
Maximize
IC performance
Sheet materials that transfer heat generated by IC chips,
such as CPUs, to the heat sink to protect the device from heat.
Applications
-
Data center
- Spine and Leaf
Switching IC
- Spine and Leaf
-
Base station
- ASIC
- FPGA
- Antenna amplifier
-
Optical transceiver
- QSFP-DD
- Silicon PIC
- DSP
-
Supercomputer
- CPU
- GPU
Comparison of Thermal grease and
Thermal conductive sheet
The reliability of our thermal conductive sheet
Performance test of the thermal conductive sheets in a smartphone
* Benchmark Software : AnTuTu Benchmark v6.2
Compressibility change in high temperature storage test
Test conditions
- Storage temp. : 150℃
- Test item : Compressibility in 3 kgf/cm² loaded
- Specimen : Ø20 mm x 2 mmt
- Remarks : The ZX11N used in the evaluation was formulated to have the same thermal conductivity as aluminum-nitride filler-filled products by adjusting the amount of boron-nitride filler.
Product Lineup
ZX11N series
Insurated type with oriented boron nitride as a filler. Our originally developed orientation technology achieves both high thermal conductivity and flexibility.
Features
- Thermal conductivity: 11 W/m·K
- Hardness: 50 - 60 (Shore OO)
- Our unique Boron Nitride orientation technology achieves both excellent thermal conductivity and Highly flexiblity.
- Even though all the raw materials are insulators, it has excellent thermal conductivity and quickly transfers heat to heat sinks.
- Compared to general thermal conductive pad that are highly filled with spherical fillers, it can maintain high flexibility and heat dissipation reliability.
- Halogen-free with high levels of flame resistance.
EX10000F7 series
This thermal conductive sheet has an extremely high thermal conductivity in the direction perpendicular to the sheet plane and is best for heat dissipation of devices that have a high heat generation density such as LSIs.
Features