Double coated tapes

Heat sensitive adhesive double coated tapes

Low-temperature heat activation type. Enables bonding with low heat resistant materials.

  • Product name
  • Features
    • No solvent used at coating process. UV curable manufacturing method.
    • High heat resistance ; can be used in environments of up to 140°C after bonding, unlike other heat activated type.
    • Tentative positioning is possible due to adhesive surface.



Product name UT6105HM
Main component Acrylic resin
Carrier Non-carrier
Color Transparent
Adhesive thickness(µm) About 50
Release paper thickness (µm) About 140
Bonding strength(N/20mm) *1 15
St'd size(width & length) 480mm x 50m
Warranty period from manufacturing date 12 months
  • *1 180° peeling strength

Ideal for bonding exterior parts (metals) and housing(plastics).

1.Bonding strength on various type of substrate(180° peeling)

Test Piece condition

Tape width: 20mm
Bonding condition: Temperature 90°C / Time 10 sec / Pressure 0.28MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 300mm/min
Backing material: 25µm PET

[Left at RT for one hour before measurement]



180° peeling strength Product name Substrate
UT6105HM 15 14 13 16

2.Holding power at different temperatures

Test Piece condition

Substrate: Stainless steel plate(SUS304)
Bonding area : 25mm x 25mm
Bonding condition: Temperature 90°C / Time 10 sec / Pressure 0.28MPa(5kgf/cm2)
Backing material: 25µm PET

[Left at RT for one hour and then at each temperature for 30 minutes before measurement]
[Creep length after one hour application of 1-kg load]

Creep length(mm) Product name Measurement temperature
40°C 100°C 140°C
UT6105HM 0.1 0.2 0.2


Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.