Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Glass for small-to-medium-sized FPDs

Suitable for interconnection of small-to-medium-sized FPDs and film materials.

Product Lineup

Product Name CP133 series PAF700 series
Type FOG FOG/FOP
Connection material TCP/COF/FPC COF
Glass substrate Glass substrate/Flexible substrate
Minimum space [µm]※1 25 5
Minimum connection area [µm2] ※2 12,000 1,000 to 1,500
Thickness [µm] 18, 25 10
Conductive particles Type Ni plating on a polymer particle Ni plating on a polymer particle
Particle diameter [µmФ] 4 3.2
Insulation coated particle Yes
Main bonding conditions Temperature [℃] 180 to 200 160 to 180
Time [sec] 8 5
Pressure [MPa] ※3 3 to 5 3 to 8
  • ※1Minimum space: Space between neighboring circuits.
  • ※2Please contact us for information on σ value control of the minimum connective area for each product individually.
  • ※3Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB and FOF mounting is described as the bonding area.