Adhesive

Thermosetting adhesives

Thermosetting adhesives comprising the SA2400 series compatible with a wide range of adherends and the SA5000 series featuring superior electric and thermal conductivity. The SA5000 series enables low temperature fast curing, making the product suitable for use as a solder-substitute for mounting components by compounding of silver particles.

Product Lineup

Product name SA2410HB SA5210HN
Resin type
Epoxy
Thermosetting condition (Recommend) ※1 Temperature[℃] 80 125
Time[min] 10 or more
5 or more
Viscosity [mPa・s] ※2 18,000 15,000
Color
Black opaque Silver
Thixotropic index ※2 3.9 4.3
Hardness ※3 D80 D90
Shrinkage by cure [%] ※4 1.3 3.9
Specific electrical resistance [Ωcm] ※5 - 0.003
Elastic modulus [MPa] ※6 4,100 8,000
Tg [℃] ※7 50 125
Keeping temperature [℃] -35 to -15
  • ※1Adhesive Temp.
  • ※2Rheo-meter @25°C
  • ※3Durometer (Code D)
  • ※4Density meter
  • ※5Low-resistance meter
  • ※6JIS K7197, DMS method:1Hz@25℃
  • ※7JIS K7244