Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Film On Board / Film for alternative to connector and solder connection

Suitable for interconnection of rigid board and film materials or interconnection between film materials. The lineup includes types that can be stored at room temperature.

  • Product name
    CP850CG-35AJ
  • Features
    • Easily bonded using simple bonders such as solder bonding devices.
    • Storable for 2 years at room temperature.
    • Lower height interconnect can be achieved by ACF compare to mechanical connector.

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Structure

Specifications

Product name CP850CG-35AJ
Type FOB/FOF
Connection material FPC
PWB
Minimum space [µm]*1 100
Minimum connection area [µm2]*2 200,000
Thickness [µm] 35
Conductive particles Type Ag plating on a polymer core particle
Particle diameter [µmФ] 20
Insulation coated particle No
Main bonding conditions Temperature [℃] 110 to 140
Time [sec] 3 to 7
Pressure [MPa]*3 1 to 3
  • *1Minimum space: Space between neighboring circuits.
  • *2Please contact us for information on σ value control of the minimum connective area for each product individually.
  • *3Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB and FOF mounting is described as the bonding area.

Replacing connectors / soldering interconnect.

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

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