Anisotropic Conductive Film (ACF)

Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized FPDs

Suitable for direct bonding of driver IC which drives a flat panel display onto glass substrate. With both excellent conductivity and insulating property between terminals for fine pitch interconnection.

  • Product name
    CP345 series
  • Features
    • Excellent conductivity and insulating performance between terminals by insulation coated particles
    • A large number of bumps with fine pitch can be bonded at one time by an optimum thermal compression.
    • The warpage of the IC chip was decreased by low temperature bonding from 150°C to 180°C.
    • Efficient capturing performance of conductive particle and compatibility for fine-pitch application can be achieved by the 2 layer structure of ACF accommodates adhesive layer and non-conductive layer.
    • Excellent connective reliability.

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Structure

Specifications

Product name CP345 series
Type COG
Connection material IC
Glass substrate
Minimum space [µm]*1 12
Minimum connection area [µm2]*2 1,000 or 1,400
Thickness [µm] 18
Conductive particles Type Ni plating on a polymer core particle
Particle diameter [µmФ] 3
Insulation coated particle Yes
Main bonding conditions Temperature [℃] 150 to 180
Time [sec] 5
Pressure [MPa]*3 30 to 80
  • *1Minimum space: Space between neighboring circuits.
  • *2Please contact us for information on σ value control of the minimum connective area for each product individually.
  • *3Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB and FOF mounting is described as the bonding area.

Interconnection of small-to-medium-sized FPDs and an IC chip.

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

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