Thermal conductive sheet
Thermal conductive sheet Carbon fiber type
This thermal conductive sheet has an extremely high thermal conductivity in the direction perpendicular to the sheet plane and is best for heat dissipation of devices that have a high heat generation density such as LSIs.
- Product name
- EX20000C9S series
- Thermal conductivity：35 W/m·K, Hardness：20 - 35（Shore OO）
- It has the highest flexibility among our carbon fiber type thermal conductive sheets.
- For advanced process LSIs that have low load-bearing properties, it can fill gaps in thermal dissipation structures with a low load.
- Suitable for heat measures for high-heat generating devices such as LSIs used in communication base station equipment.
|Product name||EX20000C9S series||Remarks|
|Features||High degree of thermal conductivity; Extremely flexible||-|
|Thermal conductivity (W/m·K)||35||Estimated bulk
|Hardness||20 - 35||Shore OO
|Available thickness (mm)*||1.5 - 3.0||-|
|Volume resistance (Ω・cm)||10||JIS K7194|
- The values in the table above are not guaranteed product values.
- *Thickness of a thermal conductive sheet only. Release films are not included
Available in 0.1 mm increments.
＜Product name configuration＞
Heat dissipation of LSIs and other devices with large heat generation used for applications such as mobile devices, TVs, PCs, wireless communication base stations, wired communication base stations, servers, and automotive equipment.
Relationship between thermal resistance, compression ratio and pressure
Measuring condition：23°C±5°C 60%±20%RH
Setting electric power of heater：24W
Unit of thermal resistance：°C・cm2/W
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
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