Thermal conductive sheet

Thermal conductive sheet Carbon fiber type

This thermal conductive sheet has an extremely high thermal conductivity in the direction perpendicular to the sheet plane and is best for heat dissipation of devices that have a high heat generation density such as LSIs.

  • Product name
    EX10000F7 series / EX20000C7 series / EX20000C4S series
  • Features
    • EX10000F7 series: With excellent flexibility, thermal conductive sheets of this series are suitable for heat dissipation of application processors (AP) of smartphones and high-performance devices such as LSIs used in communication base station equipment.
    • EX20000C7 series: With excellent flexibility and high thermal conductivity, thermal conductive sheets of this series are suitable for heat dissipation of high-performance devices such as LSIs used in data servers and routers.
    • EX20000C4S series: The thermal conductive sheets of this series have the lowest thermal resistivity among these series. Sheets with a thickness of 0.3 mm are available, and they can replace thermal grease, thermal compounds, and other heat dissipation materials.

Structure

Specifications

Product name EX10000F7 series EX20000C7 series EX20000C4S series Remarks
Features Extremely flexible Extremely flexible High degree of thermal conductivity; Thin sheets -
Thermal conductivity
(W/m·K)
30 35 40 Estimated bulk thermal conductivity
Main component Silicone base Silicone base Silicone base -
Color Gray Gray Gray -
Hardness 50 to 60 55 to 65 70 to 80 Shore OO
ASTM D2240
Available thickness
(mm)
*
0.4 to 3.0 0.5 to 3.0 0.3 to 0.5 -
Specific gravity 2.4 2.4 2.4 -
Volume resistance
(Ω・cm)
10 10 10 JIS K7194
Flame retardance V-0 V-0 V-0 UL94
File No.E63260
Warranty
period from manufacturing date
12 months 12 months 12 months -
  • The values in the table above are not guaranteed product values.
  • *Thickness of a thermal conductive sheet only. Release films are not included
    Available in 0.1 mm increments.

<Product name configuration>

ex10000f7_construction.gif

Heat dissipation of LSIs and other devices with large heat generation used for applications such as mobile devices, TVs, PCs, wireless communication base stations, wired communication base stations, servers, and automotive equipment.

Compression Pressure and Thermal Resistance;
Compression Pressure and Compressibility

Test Condition

Specimen area:3.14cm2
Measuring condition:23°C±5°C 60%±20%RH
Setting electric power of heater:24W
Unit of thermal resistance:°C・cm2/W

Results

【EX10000F7 series】

ex10000f7_chart_01.gif

【EX20000C7 series】

ex10000f7_chart_02.gif

【EX20000C4S series】

ex10000f7_chart_03.gif

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.