UV-curable adhesives

Adhesives that cure rapidly when irradiated by ultraviolet and are suitable for fixing and lamination of high-precision components.

  • Product name
    SA3000 series
  • Features
    • Features high UV-curing reactivity and the ability to cure repidly contributing to short takt time.
    • Low ionic impurity content makes this product suitable for applications such as reinforcement of FPC wiring connection and moisture-proof coating of IC-chip metal wiring.
    • The low water vapor transmission and low water absorption rate are suitable for sealant of metal wiring even in high-temperature, high-humidity environments.

Product Lineup


Product Name SA3600SN
Resin type Acrylic
UV curing condition (Recommend) [mJ/cm2 ]*1 3,000 or more
Viscosity [mPa・s] *2 1,000
Color Light yellow
Thixotropic index *2 -
Hardness *3 A83
Shrinkage by cure [%] *4 5.2
Elastic modulus [MPa] *5 15
Tg [°C] *6 -16
Water Vapor Transmission [g/m2・24h] *7 28
Water absorption [%] *8 0.6
Keeping temperature [°C] 10 to 30
  • *1 Metal-halide lamp
    *2 Rheo-meter @25℃
    *3 Durometer (Code A)
    *4 Density meter
    *5 JIS K7197 DMS method:1Hz@25℃
    *6 JIS K7244
    *7 Cup method (60°C/90%)
    *8 Boil x 2hours

Suitable for applications such as reinforcement of anisotropic conductive film (ACF) connections, reinforcement of FPC connections and moisture-proof metal coating of IC-chip mounting.


Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

Product Lineup