Double coated tapes

Special resin base hotmelt double coated tapes

Flexible. Highly thermal conductive.

  • Product name
    NP608
  • Features
    • Punching and bending possible after lamination to materials such as Aluminum and removal of release paper.
    • Low-temperature heat activation type enables bonding at 90°C.
    • The tape is tack-free at room temperature, enabling punching and spinning without release paper.

Product Lineup

Structure

Specifications

Product name NP608
Main component Special resin base
Carrier Non-carrier
Color Translucent white
Adhesive thickness(µm) About 50
Release paper thickness(µm) About 60
Bonding strength(N/40mm x 40mm) *1 240
St'd size(width & length) 400mm x 100m
Warranty period from manufacturing date 12 months
  • *1 Cleavage strength to aluminum foil/ABS

  • Recommended bonding condition: Temperature / 100°C to 140°C, Time / 8 sec to 15 sec, Pressure / 0.2MPa to 0.3MPa

Ideal for bonding plastics and metals.

1.Bonding strength at different temperatures (180° peeling)

Test Piece condition

Substrate:ABS plate
Tape width:20mm
Bonding condition:Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:100mm/min
Backing material:50µm aluminum foil

[Left at RT for 30 minutes and then at each temperature for 30 minutes before measurement]

Results
np608_chart_01.gif

2.Bonding strength at different temperatures (Cleavage strength)

Test Piece condition

Substrate:Aluminum plate (t=0.4mm) / ABS plate (t=5mm)
Bonding area:40mm x 40mm
Bonding condition:Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:20mm/min

[Left at RT for one day and then at each temperature for 30 minutes before measurement]

Results
np608_chart_02.gif

3.Reliability of bonding strength under different conditions (Cleavage strength)

Test Piece condition

Substrate:Aluminum plate (t=0.4mm) / ABS plate (t=5mm)
Bonding area:40mm x 40mm
Bonding condition:Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:20mm/min

[Left at RT for one day and then at each temperature for 30 minutes before measurement]

Results
np608_chart_03.gif

4.Initial Bonding strength against different types of substrate (Cleavage strength)

Test Piece condition

Substrate:Aluminum plate (t=0.4mm) / ABS plate (t=5mm)
Bonding area:40mm x 40mm
Bonding condition:Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:20mm/min

[Left at RT for one day and then at each temperature for 30 minutes before measurement]

Results
np608_chart_04.gif

5.Bonding strength at different bonding temperatures(Cleavage strength)

Test Piece condition

Substrate:Aluminum plate (t=0.4mm) / ABS plate (t=5mm)
Bonding area:40mm x 40mm
Bonding condition:Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:20mm/min

[Left at RT for one day and then at each temperature for 30 minutes before measurement]

Results
np608_chart_05.gif

6.Shear strength at different temperatures

Test Piece condition

Substrate:SUS plate (t=0.5mm) / PC, ABS plate (t=5mm)
Bonding area:20mm x 20mm
Bonding condition:Temperature / 90°C to 150°C, Time / 10sec, Pressure / 0.3MPa
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:20mm/min

[Left at RT for one day before measurement]

Results
np608_chart_06.gif

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

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