Double coated tapes

Thermosetting tapes for FPC

Thermosetting tapes suitable for fixing of backing materials and terminals.

  • Product name
    D3451/D3450
  • Features
    • Excellent resistance to heat from solder reflow after moisture absorption.
    • Short curing time enables shorter processing time. Ideal for hot press, quick press and oven-curing.
    • Storage at room temperature; easy handling.
    • Initial tack enables tentative positioning.

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Structure

Specifications

Product name D3451 D3450
Main component Acrylic/Epoxy base Acrylic/Epoxy base
Carrier Non-carrier Non-carrier
Color White White
Adhesive thickness(µm) About 25 About 35
Release film thickness (µm) About 38 About 38
Release paper thickness (µm) About 130 About 130
Bonding strength(N/10mm) *1 25 31
St'd size(width & length) 500mm x 100m 500mm x 100m
Warranty period from manufacturing date 6 months 6 months
  • *1 90 peeling strength to polyimide
  • *Recommended curing conditions:
    1.Quick press (Temperature / 160°C to 180°C Time/1 min to 2 min(vacuum time / 10 sec to 30 sec), Pressure/1MPa to 2MPa)→Oven curing (60 min at 140°C),
  • 2.Press(160°C, 60 min, 3MPa)

Ideal for fixing FPC stiffeners(glass epoxy, polyimide)that undergo heat treatment(e.g., solder reflow).

1.Bonding strength on various type of substrate (90° peeling)

Test Piece Condition

Tape width:10mm
Bonding condition:* Recommended curing conditions listed above
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:50mm/min
Backing material:CCL(=Copper Clad Laminate)

[Left at RT for one hour before measurement]

Results

(N/10mm)

90° peeling strength Product name Long press Quick press and post cure

CCL/
PI

CCL/
GE
CCL/
AL
CCL/
SUS
CCL/
PI
CCL/
GE
CCL/
AL
CCL/
SUS
D3451 Normal 21 22 15 16 25 23 15 16
After reflow 21 22 15 16 25 23 15 16
D3450 Normal 26 28 16 18 31 27 16 17
After reflow 26 28 16 18 31 28 16 18

2.Solder reflow process heat resistance

Test Piece Condition

Substrate:Polyimide film
Bonding condition :* Recommended curing conditions and treatment before reflow process
(A) Dry processing:100°C 1 hour
(B) Moisture absorption processing:40°C 90%RH 96 hours
Solder reflow condition:Top 260°C (Reference profile)
Measuring condition:23°C±5°C 60%±20%RH
Backing material:CCL(=Copper Clad Laminate)

[Left at RT for one hour before measurement]
[Appearance after solder reflow process]

Results
Heat resistance Product name Long press Vacuum quick press and postcure
Dry Moisture absorption Dry Moisture absorption
1/100/- 96/40/90 1/100/- 96/40/90
D3451 260°C pass 260°C pass 260°C pass 260°C pass
D3450 260°C pass 260°C pass 260°C pass 260°C pass
  • ※ Treatment condition: time (h) / temperature(°C) / humidity(%)

d3430_chart_01.gif

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

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