Double coated tapes

Thermosetting tapes for FPC

Thermosetting tapes suitable for fixing of backing materials and terminals.

  • Product name
    D3432/D3431/D3430
  • Features
    • Excellent resistance to heat from solder reflow after moisture absorption.
    • Storage at room temperature; easy handling.
    • Initial tack enables tentative positioning.

Product Lineup

Structure

Specifications

Product name D3432 D3431 D3430
Main component Acrylic/Epoxy base Acrylic/Epoxy base Acrylic/Epoxy base
Carrier Non-carrier Non-carrier Non-carrier
Color Light yellow Light yellow Light yellow
Adhesive thickness(µm) About 13 About 22 About 35
Release film thickness (µm) About 38 About 38 About 38
Release paper thickness (µm) About 115 About 115 About 115
Bonding strength(N/10mm) *1 15 22 25
St'd size(width & length) 500mm x 100m 500mm x 100m 500mm x 100m
Warranty period from manufacturing date 6 months 6 months 6 months
  • ※1 90 peeling strength to polyimide
    * Recommended curing conditions:
    1.Quick press(Temperature / 160°C to 180°C, Time / 2 min, Pressure / 1MPa) →Oven curing(120 min at 140°C),
    2.Press(160°C, 120 min, 3MPa)

Ideal for fixing FPC stiffeners(glass epoxy, polyimide) that undergo heat treatment ( e.g., solder reflow).

1.Bonding strength on various type of substrate (90° peeling)

Test Piece Condition

Substrate:Glass epoxy / Polyimide / Aluminum / Stainless steel plate
Tape width:10mm
Bonding condition :* Recommended curing conditions listed above
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:50mm/min
Backing material:CCL(=Copper Clad Laminate)

[Left at RT for one hour before measurement]

Results

(N/10mm)

90° peeling strength Product name Long press Vacuum quick press and post cure
CCL/
PI
CCL/
GE
CCL/
AL
CCL/
SUS
CCL/
PI
CCL/
GE
CCL/
AL
CCL/
SUS
D3432 15 13 10 16 13 13 7 15
D3431 22 14 14 20 18 14 10 19
D3430 25 16 20 25 23 16 14 23

2.Solder reflow process heat resistance

Test Piece Condition

Substrate:Polyimide film
Tape width:10mm
Bonding condition :* Recommended curing conditions listed above
Measuring condition:23°C±5°C 60%±20%RH
Peeling speed:50mm/min
Backing material:CCL(=Copper Clad Laminate)
* Solder reflow condition:Refer to the solder reflow profile chart

[Left at RT for one hour before measurement]

Results
Heat resistance Product name Long press Vacuum quick press and postcure
Treatment before reflow: Dry Moisture absorption Treatment before reflow: Dry Moisture absorption
1/100/- 96/40/90 1/100/- 96/40/90
D3432 No change No change No change No change
D3431 No change No change No change No change
D3430 No change No change No change No change
  • ※ Treatment condition: time (h) / temperature(°C) / humidity(%)

  • d3430_chart_01.gif

caution

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

Product Lineup